Invention Grant
- Patent Title: Component carrier comprising dielectric structures with different physical properties
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Application No.: US16775794Application Date: 2020-01-29
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Publication No.: US11116075B2Publication Date: 2021-09-07
- Inventor: Kim Liu , Nick Xin , Howard Li , Henry Guo
- Applicant: AT&S (China) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: AT&S (China) Co. Ltd.
- Current Assignee: AT&S (China) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN201910156775.0 20190301
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H01L23/538 ; H01L23/31 ; H01L23/00 ; H05K1/03 ; H01L21/56 ; H05K3/00 ; H01L21/48
Abstract:
A component carrier with a stack having at least one electrically conductive layer structure and a plurality of electrically insulating layer structures and a component embedded in the stack. The plurality of electrically insulating layer structures include a first dielectric structure and a second dielectric structure differing concerning at least one physical property.
Public/Granted literature
- US20200281071A1 Component Carrier Comprising Dielectric Structures With Different Physical Properties Public/Granted day:2020-09-03
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