Invention Grant
- Patent Title: Multi-floor data center cooling system
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Application No.: US16710121Application Date: 2019-12-11
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Publication No.: US11116103B2Publication Date: 2021-09-07
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: Baidu USA LLC
- Current Assignee: Baidu USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/20

Abstract:
A multi-floor data center can include a data center building having a plurality of floors, a single centralized air intake module spanning each of the plurality of floors, a number of cooling coil modules, a centralized liquid cooling system, and a number of IT modules. Each of the floors includes at least one of the cooling coil modules configured to receive external air from the single air intake module to cool a cooling coil. The centralized liquid cooling system is configured to circulate cooling liquid to the cooling coil for each of the cooling coil modules. Each of the floors includes one of the IT modules configured to house computing systems, and internal air is cooled at each of the cooling coil modules and introduced into each of the IT modules to cool the computing systems. Each floor can be equipped with different modular cooling systems with different cooling capacities.
Public/Granted literature
- US20210185847A1 MULTI-FLOOR DATA CENTER COOLING SYSTEM Public/Granted day:2021-06-17
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