Invention Grant
- Patent Title: Method for manufacturing high-sensitivity piezoresistive sensor using multi-level structure design
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Application No.: US16314820Application Date: 2018-06-27
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Publication No.: US11120930B2Publication Date: 2021-09-14
- Inventor: Tao Liu , Xiaoshuang Duan , Jiangjiang Luo , Yanbo Yao
- Applicant: SOOCHOW UNIVERSITY
- Applicant Address: CN Suzhou
- Assignee: SOOCHOW UNIVERSITY
- Current Assignee: SOOCHOW UNIVERSITY
- Current Assignee Address: CN Suzhou
- Agency: SZDC Law PC
- Priority: CN201710984186.2 20171020
- International Application: PCT/CN2018/093045 WO 20180627
- International Announcement: WO2019/076079 WO 20190425
- Main IPC: H01C17/28
- IPC: H01C17/28 ; G01D5/16

Abstract:
The present invention discloses a method for manufacturing a high-sensitivity piezoresistive sensor using a multi-level structure design, including the following steps: forming first-level basic geometrical units formed of basic structural units on a substrate, where each first-level basic geometrical unit is a two-dimensional or three-dimensional network structure formed by stacking several basic structural units; stacking and combining several first-level basic geometrical units in an array to form a second-level geometrical structure, and forming a contact connection area located between adjacent first-level basic geometrical units; and dispensing a conductive adhesive in at least two positions on the substrate to form electrodes of a piezoresistive sensor, so as to obtain the piezoresistive sensor. A high-sensitivity piezoresistive sensor obtained by using the method of the present invention has flexible design and simple fabrication, can be desirably combined with various existing sensor fabrication methods, and has general applicability.
Public/Granted literature
- US20210098159A1 METHOD FOR MANUFACTURING HIGH-SENSITIVITY PIEZORESISTIVE SENSOR USING MULTI-LEVEL STRUCTURE DESIGN Public/Granted day:2021-04-01
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