Invention Grant
- Patent Title: Substrate transfer device, substrate processing system, substrate processing method and computer-readable recording medium
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Application No.: US16765902Application Date: 2018-11-09
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Publication No.: US11120985B2Publication Date: 2021-09-14
- Inventor: Munehisa Kodama
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JPJP2017-224672 20171122
- International Application: PCT/JP2018/041637 WO 20181109
- International Announcement: WO2019/102868 WO 20190531
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/02 ; B24B37/27
Abstract:
A substrate transfer device configured to transfer a substrate while holding a first surface of the substrate by a substrate holder and configured to deliver a second surface of the substrate is provided. The substrate transfer device includes a tilting mechanism configured to perform tilting of the substrate holder when viewed from a side; and a fixing mechanism configured to stop the tilting of the substrate holder when viewed from the side.
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