Invention Grant
- Patent Title: Method for arranging two substrates
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Application No.: US16487647Application Date: 2017-03-20
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Publication No.: US11121091B2Publication Date: 2021-09-14
- Inventor: Thomas Wagenleitner
- Applicant: EV Group E. Thallner GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- International Application: PCT/EP2017/056584 WO 20170320
- International Announcement: WO2018/171861 WO 20180927
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/68 ; H05K13/00
Abstract:
A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates, and aligning the substrates with respect to each other in accordance with the detected positions.
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