Invention Grant
- Patent Title: Thermal chamber for a thermal control component
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Application No.: US16218038Application Date: 2018-12-12
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Publication No.: US11121125B2Publication Date: 2021-09-14
- Inventor: Daniel G. Scobee , Aleksandr Semenuk , Aswin Thiruvengadam
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G05D23/00
- IPC: G05D23/00 ; H01L27/02 ; H01L35/04 ; H05K1/02 ; G01K7/02 ; G06F1/20

Abstract:
A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.
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