Invention Grant
- Patent Title: Low resistance pickup cells for SRAM
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Application No.: US16858460Application Date: 2020-04-24
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Publication No.: US11121138B1Publication Date: 2021-09-14
- Inventor: Yi-Hsun Chiu , Cheng-Chi Chuang , Shang-Wen Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes & Boone LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/033 ; H01L21/8238 ; H01L27/02 ; H01L27/092 ; H01L27/11 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
A semiconductor device includes a transistor and a memory pickup cell formed over a well in a substrate. The transistor includes a first fin having a first width and two first source/drain features on the first fin. The pickup cell includes a second fin having a second width and two second source/drain features on the second fin. The well, the first fin, the second fin, and the second source/drain feature are of a first conductivity type. The first source/drain features are of a second conductivity type opposite to the first conductivity type. The second width is at least three times of the first width. The pickup cell further includes a stack of semiconductor layers over the second fin and connecting the two second source/drain features.
Information query
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