Invention Grant
- Patent Title: Solid-state image pickup apparatus and electronic equipment
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Application No.: US16496619Application Date: 2018-03-16
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Publication No.: US11121158B2Publication Date: 2021-09-14
- Inventor: Hiroaki Ammo , Hirokazu Ejiri , Akiko Honjo
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2017-071599 20170331
- International Application: PCT/JP2018/010392 WO 20180316
- International Announcement: WO2018/180574 WO 20181004
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L27/30 ; H01L27/146 ; H01L29/10 ; H01L27/118

Abstract:
The present technology relates to a solid-state image pickup apparatus and electronic equipment that makes it possible to suppress read noise. A solid-state image pickup apparatus according to a first aspect of the present technology includes a photoelectric conversion section that generates and holds a charge in response to incident light, a transfer section that includes a V-NW transistor (Vertical Nano Wire transistor) and transfers the charge held in the photoelectric conversion section, and an accumulation section that includes a wiring layer connected to a drain of the transfer section including the V-NW transistor and accumulates the charge transferred by the transfer section. The present technology is applicable to a CMOS image sensor, for example.
Public/Granted literature
- US20200020728A1 SOLID-STATE IMAGE PICKUP APPARATUS AND ELECTRONIC EQUIPMENT Public/Granted day:2020-01-16
Information query
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