Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16583443Application Date: 2019-09-26
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Publication No.: US11121248B2Publication Date: 2021-09-14
- Inventor: Yoshihisa Suzuki , Keishirou Kumada , Yasuyuki Hoshi , Yuichi Hashizume
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2017-195431 20171005
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L27/06 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/16 ; H01L29/49

Abstract:
In an effective region of an active region, a main semiconductor element and a source pad thereof are disposed. A non-operating region of the active region excludes the effective region and is a high-function region in which a gate pad of the main semiconductor element and other electrode pads are disposed. An edge termination region and the electrode pads are separated by an interval equivalent to at least a width of one unit cell of the main semiconductor element. In the high-function region, at a border of the edge termination region, a lead-out electrode is provided on a front surface of a semiconductor substrate. The lead-out electrode has a function of leading out displacement current that flows to the high-function region from the edge termination region when the main semiconductor element is OFF. Thus, destruction at the edge termination region may be suppressed.
Public/Granted literature
- US20200020797A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-01-16
Information query
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