Invention Grant
- Patent Title: Resonator structure encapsulation
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Application No.: US16348830Application Date: 2016-12-29
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Publication No.: US11121691B2Publication Date: 2021-09-14
- Inventor: Kevin Lin , Kimin Jun , Edris Mohammed
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/069315 WO 20161229
- International Announcement: WO2018/125165 WO 20180705
- Main IPC: H03H3/02
- IPC: H03H3/02 ; H03H9/17

Abstract:
The RF filters used in conventional mobile devices often include resonator structures, which often require free-standing air-gap structure to prevent mechanical vibrations of the resonator from being damped by a bulk material. A method for fabricating a resonator structure comprises depositing a non-conformal thin-film to the resonator structure to seal air gap cavities in the resonator structure.
Public/Granted literature
- US20190267961A1 RESONATOR STRUCTURE ENCAPSULATION Public/Granted day:2019-08-29
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