Invention Grant
- Patent Title: Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
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Application No.: US16480088Application Date: 2018-01-19
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Publication No.: US11122685B2Publication Date: 2021-09-14
- Inventor: Shota Koga , Kentaro Takano
- Applicant: Mitsubishi Gas Chemical Company, Inc.
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-012365 20170126
- International Application: PCT/JP2018/001624 WO 20180119
- International Announcement: WO2018/139368 WO 20180802
- Main IPC: C08L75/14
- IPC: C08L75/14 ; H05K1/03 ; C08J5/18 ; C08L63/00
Abstract:
A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).
Public/Granted literature
- US11166370B2 Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board Public/Granted day:2021-11-02
Information query
