Invention Grant
- Patent Title: Reduced volume processing chamber
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Application No.: US16352631Application Date: 2019-03-13
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Publication No.: US11133174B2Publication Date: 2021-09-28
- Inventor: Roman Gouk , Han-Wen Chen , Steven Verhaverbeke , Jean Delmas
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67

Abstract:
Embodiments described herein generally relate to a processing chamber having a reduced volume for performing supercritical drying processes or other phase transition processes. The chamber includes a substrate support moveably disposed on a first track and a door moveably disposed on a second track. The substrate support and door may be configured to move independently of one another and the chamber may be configured to minimize vertical movement of the substrate within the chamber.
Public/Granted literature
- US20190214247A1 REDUCED VOLUME PROCESSING CHAMBER Public/Granted day:2019-07-11
Information query
IPC分类: