Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16964230Application Date: 2018-12-26
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Publication No.: US11133396B2Publication Date: 2021-09-28
- Inventor: Yuzo Fukuzaki
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2018-013471 20180130
- International Application: PCT/JP2018/047706 WO 20181226
- International Announcement: WO2019/150856 WO 20190808
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/10 ; H01L29/06

Abstract:
A semiconductor device includes a stacked structure having channel formation region layers CH1 and CH2, gate electrode layers G1, G2, and G3 alternately arranged on a base, in which a lowermost layer of the stacked structure is formed with a 1st layer G1 of the gate electrode layers, an uppermost layer of the stacked structure is formed with an Nth (where N≥3) layer G3 of the gate electrode layers, the gate electrode layers each have a first end face, a second end face, a third end face opposing the first end face, and a fourth end face opposing the second end face, the first end face of odd-numbered layers G1, G3 of the gate electrode layers is connected to a first contact portion, and the third end face of an even-numbered layer G2 of the gate electrode layers is connected to a second contact portion.
Public/Granted literature
- US20210043748A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-02-11
Information query
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