Invention Grant
- Patent Title: Methods of forming semiconductor devices having plural epitaxial layers
-
Application No.: US16549050Application Date: 2019-08-23
-
Publication No.: US11133416B2Publication Date: 2021-09-28
- Inventor: Yan-Ting Lin , Hsueh-Chang Sung , Yen-Ru Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L29/66 ; H01L29/417 ; H01L29/06 ; H01L21/02

Abstract:
In an embodiment, a device includes: a fin extending from a substrate; a gate stack over a channel region of the fin; and a source/drain region in the fin adjacent the channel region, the source/drain region including: a first epitaxial layer contacting sidewalls of the fin, the first epitaxial layer including silicon and germanium doped with a dopant, the first epitaxial layer having a first concentration of the dopant; and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer including silicon and germanium doped with the dopant, the second epitaxial layer having a second concentration of the dopant, the second concentration being greater than the first concentration, the first epitaxial layer and the second epitaxial layer having a same germanium concentration.
Public/Granted literature
- US20210057570A1 Semiconductor Device and Method Public/Granted day:2021-02-25
Information query
IPC分类: