Invention Grant
- Patent Title: Binding agents for electrochemically active materials and methods of forming the same
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Application No.: US15995002Application Date: 2018-05-31
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Publication No.: US11133498B2Publication Date: 2021-09-28
- Inventor: David J. Lee , Xiaohua Liu , Monika Chhorng , Jeff Swoyer , Benjamin Yong Park , Rahul R. Kamath
- Applicant: Enevate Corporation
- Applicant Address: US CA Irvine
- Assignee: Enevate Corporation
- Current Assignee: Enevate Corporation
- Current Assignee Address: US CA Irvine
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01M4/36
- IPC: H01M4/36 ; H01M4/133 ; H01M4/134 ; H01M4/66 ; H01M4/587 ; H01M4/38 ; H01M10/0525 ; H01M4/62 ; H01M4/1393 ; H01M4/1395 ; H01M4/02 ; H01M4/04

Abstract:
In some embodiments, an electrode can include a current collector, a composite material in electrical communication with the current collector, and at least one phase configured to adhere the composite material to the current collector. The current collector can include one or more layers of metal, and the composite material can include electrochemically active material. The at least one phase can include a compound of the metal and the electrochemically active material. In some embodiments, a composite material can include electrochemically active material. The composite material can also include at least one phase configured to bind electrochemically active particles of the electrochemically active material together. The at least one phase can include a compound of metal and the electrochemically active material.
Public/Granted literature
- US20190181434A1 BINDING AGENTS FOR ELECTROCHEMICALLY ACTIVE MATERIALS AND METHODS OF FORMING THE SAME Public/Granted day:2019-06-13
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