Invention Grant
- Patent Title: Electronic device with segmented housing having molded splits
-
Application No.: US16205145Application Date: 2018-11-29
-
Publication No.: US11133572B2Publication Date: 2021-09-28
- Inventor: Yaocheng Zhang , John J. Baker , Martin J. Auclair , Paul U. Leutheuser , Christopher J. Durning , Jun Ham
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01Q1/38 ; H04B1/3888 ; G06F1/18 ; H01Q9/30 ; H01Q9/04 ; H05K5/02 ; H01Q13/10

Abstract:
The disclosure is directed to a multi-segment housing for an electronic device that includes multiple conductive segments that are structurally coupled by one or more non-conductive housing segments or splits. One or more of the conductive segments may be configured to operate as an antenna and the non-conductive housing segments may provide electrical insulation between the conductive segment and one or more adjacent housing segments. The non-conductive housing segment may be formed from a polymer having an array of fibers dispersed within the polymer. The fibers may be aligned along one or more fiber directions, which may be substantially perpendicular to an exterior surface of the housing.
Public/Granted literature
- US20200076058A1 ELECTRONIC DEVICE WITH SEGMENTED HOUSING HAVING MOLDED SPLITS Public/Granted day:2020-03-05
Information query