Invention Grant
- Patent Title: Chip interconnect devices
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Application No.: US16368926Application Date: 2019-03-29
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Publication No.: US11134562B2Publication Date: 2021-09-28
- Inventor: Matthew Doyle , Gerald Bartley , Darryl Becker , Mark J. Jeanson
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jamar K. Ray
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/32 ; H05K1/02 ; H05K3/36 ; H05K1/14

Abstract:
An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.
Public/Granted literature
- US20200314997A1 CHIP INTERCONNECT DEVICES Public/Granted day:2020-10-01
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