A processing apparatus includes a processing unit grinding or polishing the reverse side, which is exposed upwardly, of a wafer, an infrared camera unit capturing an image of the wafer from the reverse side thereof and acquiring an image including the face side of the wafer, an information register having information on a pattern of structural objects which a wafer to be processed is to have on the face side, registered therein, and a determining unit determining that the wafer to be determined is a wafer to be processed if the pattern of structural objects which a wafer to be processed is to have on the face side is found on the wafer to be determined before being processed by the processing unit.