Invention Grant
- Patent Title: Extrusion dies and methods and apparatuses for forming the same
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Application No.: US15555780Application Date: 2016-03-04
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Publication No.: US11135740B2Publication Date: 2021-10-05
- Inventor: Scott Winfield Deming , John Christopher Thomas , Kevin Lee Wasson
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Kurt R. Denniston
- International Application: PCT/US2016/020796 WO 20160304
- International Announcement: WO2016/144714 WO 20160915
- Main IPC: B28B3/26
- IPC: B28B3/26 ; B23P15/24 ; B29C48/11 ; B29C48/345 ; B28B1/00 ; B29L31/60 ; B29L31/00 ; B30B11/22

Abstract:
A honeycomb extrusion die (100), a method of making the same, and an apparatus for forming the same. The die (100) includes: a feed hole plate (202) comprising an input surface (202A), an opposing output surface (202B), and feed holes (108) configured to guide a batch material from the input surface (202A) to the output surface (202B); and a pin assembly (204) comprising pins (300) disposed on the feed hole plate (202). At least one of the pins includes: a tail (304); a head (302) connected to the tail (304) and comprising alignment surfaces (314) configured to align the pins (300), flow surfaces (316) disposed between the alignment surfaces (314), and a tapered portion (310) comprising a contact surface (308) adhered to the output surface (202B) of the feed hole plate (202); and a first groove (306) disposed between the head (302) and the tail (304). In the pin assembly (204), the alignment surfaces (314) contact adjacent pins (300) to align the pins (300), such that discharge slots are at least partially defined by the tails (304) of the pins (300).
Public/Granted literature
- US20190047174A1 EXTRUSION DIES AND METHODS AND APPARATUSES FOR FORMING THE SAME Public/Granted day:2019-02-14
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