Invention Grant
- Patent Title: Thermally conductive sheet
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Application No.: US16341976Application Date: 2017-11-30
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Publication No.: US11136484B2Publication Date: 2021-10-05
- Inventor: Masahiro Hamada , Daisuke Mukohata , Koji Shimonishi , Yuuki Hoshiyama
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2016-233140 20161130
- International Application: PCT/JP2017/043186 WO 20171130
- International Announcement: WO2018/101445 WO 20180607
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/04 ; C08J5/18 ; H01L23/373 ; B32B25/02 ; B32B25/04 ; B32B25/16 ; B32B25/20 ; C08K3/38 ; C08K3/34 ; H05K7/20 ; C08K3/28 ; C08K3/22 ; B32B27/18 ; C08L101/00 ; B32B7/02 ; H01L23/42

Abstract:
A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.
Public/Granted literature
- US20190241786A1 THERMALLY CONDUCTIVE SHEET Public/Granted day:2019-08-08
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