Invention Grant
- Patent Title: Partition
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Application No.: US17271489Application Date: 2019-08-09
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Publication No.: US11137150B2Publication Date: 2021-10-05
- Inventor: Ryoichi Nakagawa
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors, LLP
- Priority: JPJP2018-158770 20180827
- International Application: PCT/JP2019/031732 WO 20190809
- International Announcement: WO2020/045069 WO 20200305
- Main IPC: F24F1/0314
- IPC: F24F1/0314 ; F24F13/10 ; E04B2/74 ; F24F11/58 ; F24F11/63 ; F24F11/72 ; F24F120/20

Abstract:
A partition includes a first structure, a deformable partitioning portion connected to the first structure, and an air-environment adjusting portion disposed at at least one of the first structure and the deformable partitioning portion. The deformable partitioning portion has a first end portion on a side connected to the first structure and a second end portion on a distal side from the first end portion. The deformable partitioning portion partitions a predetermined space with respect to an adjacent space. The air-environment adjusting portion includes at least one of a cooling portion configured to cool air, a heating portion configured to heat air, and an airflow generating portion configured to generate an airflow.
Public/Granted literature
- US20210247078A1 PARTITION Public/Granted day:2021-08-12
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