Invention Grant
- Patent Title: Chip antenna module
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Application No.: US16506289Application Date: 2019-07-09
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Publication No.: US11139551B2Publication Date: 2021-10-05
- Inventor: Seong Hee Choi , Sang Jong Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0111749 20180918,KR10-2018-0136072 20181107
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/04 ; H01Q1/24 ; H01Q1/38 ; H01Q9/40 ; H01Q5/10 ; H01Q1/48

Abstract:
A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.
Public/Granted literature
- US20200091583A1 CHIP ANTENNA MODULE Public/Granted day:2020-03-19
Information query