Invention Grant
- Patent Title: Conductive thermal management architecture for electronic modules in a two-card assembly
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Application No.: US16810343Application Date: 2020-03-05
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Publication No.: US11140767B2Publication Date: 2021-10-05
- Inventor: Hebri Vijayendra Nayak
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Cantor Colburn LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K7/14 ; H05K7/20
Abstract:
A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.
Public/Granted literature
- US20210282258A1 CONDUCTIVE THERMAL MANAGEMENT ARCHITECTURE FOR ELECTRONIC MODULES IN A TWO-CARD ASSEMBLY Public/Granted day:2021-09-09
Information query
