Invention Grant
- Patent Title: Printed circuit board assembly
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Application No.: US15927020Application Date: 2018-03-20
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Publication No.: US11140770B2Publication Date: 2021-10-05
- Inventor: Chia-Pin Chiu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K5/00 ; H05K1/11 ; H01G4/12 ; H05K3/30

Abstract:
Printed circuit board assembly (PCBA) technology is disclosed. A PCBA can include a printed circuit board (PCB). The PCBA can also include a capacitor operably mounted on a side of the PCB. In addition, the PCBA can include a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation. An electronic system including a capacitor and damping material, and a method for minimizing acoustic vibration in an electronic system are also disclosed.
Public/Granted literature
- US20190297724A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2019-09-26
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