Invention Grant
- Patent Title: Printed circuit board and method for processing a printed circuit board
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Application No.: US16753894Application Date: 2018-10-04
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Publication No.: US11140774B2Publication Date: 2021-10-05
- Inventor: Christian Lammel , Guenther Ruppaner , Robert Bushnell , Detlev Bagung
- Applicant: VITESCO TECHNOLOGIES GMBH
- Applicant Address: DE Hannover
- Assignee: VITESCO TECHNOLOGIES GMBH
- Current Assignee: VITESCO TECHNOLOGIES GMBH
- Current Assignee Address: DE Hannover
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102017217797.7 20171006
- International Application: PCT/EP2018/077046 WO 20181004
- International Announcement: WO2019/068826 WO 20190411
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/18 ; H05K3/30 ; H01R12/57 ; H01R12/58

Abstract:
A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.
Public/Granted literature
- US20200260576A1 PRINTED CIRCUIT BOARD AND METHOD FOR PROCESSING A PRINTED CIRCUIT BOARD Public/Granted day:2020-08-13
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