Invention Grant
- Patent Title: Conductor, conductive composition and laminate
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Application No.: US15899532Application Date: 2018-02-20
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Publication No.: US11145432B2Publication Date: 2021-10-12
- Inventor: Hiroya Fukuda , Osamu Numata , Hironobu Ikeda , Toshio Nagasaka , Shinji Saiki , Hiroaki Iriyama , Masashi Uzawa , Asako Kaneko
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2012-163295 20120724,JPJP2012-208466 20120921,JPJP2013-088485 20130419,JPJP2013-100736 20130510
- Main IPC: H01B1/12
- IPC: H01B1/12 ; C09D179/02 ; C08G73/02 ; C08F20/52 ; C08F26/06 ; C09D5/24

Abstract:
The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.
Public/Granted literature
- US20180174698A1 CONDUCTOR, CONDUCTIVE COMPOSITION AND LAMINATE Public/Granted day:2018-06-21
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