Invention Grant
- Patent Title: Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor device
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Application No.: US16707875Application Date: 2019-12-09
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Publication No.: US11145582B2Publication Date: 2021-10-12
- Inventor: Federico Giovanni Ziglioli
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: IT102018000020998 20181224
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L21/768 ; H01L23/31 ; H01L21/60
Abstract:
A semiconductor chip is mounted on a leadframe. A first portion of an insulating package for the semiconductor chip is formed from laser direct structuring (LDS) material molded onto the semiconductor chip. A conductive formation (provided by laser-drilling the LDS material and plating) extends between the outer surface of the first portion of insulating package and the semiconductor chip. An electrically conductive clip is applied onto the outer surface of the first portion of the insulating package, with the electrically conductive clip electrically coupled to the conductive formation and the leadframe. A second portion of the insulating package is made from package molding material (epoxy compound) molded onto the electrically conductive clip and applied onto the outer surface of the first portion of the insulating package.
Information query
IPC分类:
