Invention Grant
- Patent Title: Bonding equipment
-
Application No.: US16294167Application Date: 2019-03-06
-
Publication No.: US11145618B2Publication Date: 2021-10-12
- Inventor: Katsuji Iguchi , Masumi Maegawa , Keiichi Sawai , Hiroyoshi Higashisaka , Takanobu Matsuo
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai
- Agency: ScienBiziP, P.C.
- Priority: JPJP2018-040056 20180306
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/677 ; H01L21/683 ; H01L23/00
Abstract:
Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.
Public/Granted literature
- US20190279956A1 BONDING EQUIPMENT Public/Granted day:2019-09-12
Information query
IPC分类:
