Invention Grant
- Patent Title: Mobile device and manufacturing method thereof
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Application No.: US16895028Application Date: 2020-06-08
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Publication No.: US11145958B2Publication Date: 2021-10-12
- Inventor: Tiao-Hsing Tsai , Chien-Pin Chiu , Hsiao-Wei Wu , Shen-Fu Tzeng , Yi-Hsiang Kung , Li-Yuan Fang
- Applicant: HTC Corporation
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38 ; H01Q1/48 ; H01Q5/35 ; H01Q5/364 ; H01Q7/00 ; H01Q9/04 ; H04B1/3827 ; H04M1/02

Abstract:
A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
Public/Granted literature
- US20200303810A1 MOBILE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-09-24
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