Invention Grant
- Patent Title: Packaging for a MEMS transducer
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Application No.: US16823971Application Date: 2020-03-19
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Publication No.: US11146894B2Publication Date: 2021-10-12
- Inventor: Roberto Brioschi , Rkia Achehboune
- Applicant: Cirrus Logic International Semiconductor Ltd.
- Applicant Address: GB Edinburgh
- Assignee: Cirrus Logic International Semiconductor Ltd.
- Current Assignee: Cirrus Logic International Semiconductor Ltd.
- Current Assignee Address: GB Edinburgh
- Agency: Jackson Walker L.L.P.
- Priority: GB1905924 20190429
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; B81B7/00 ; B81C1/00
Abstract:
The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
Public/Granted literature
- US20200304922A1 PACKAGING FOR A MEMS TRANSDUCER Public/Granted day:2020-09-24
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