Invention Grant
- Patent Title: Thermal conductivity for integrated circuit packaging
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Application No.: US16905587Application Date: 2020-06-18
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Publication No.: US11147153B2Publication Date: 2021-10-12
- Inventor: Brian J. Long
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K1/18 ; H05K3/30 ; H05K3/36 ; H05K7/10 ; H05K7/20 ; H01L23/00 ; H01L23/12 ; H01L23/13 ; H01L23/22 ; H01L23/24 ; H01L23/28 ; H01L23/31 ; H01L23/34 ; H01L23/36 ; H01L23/40 ; H01L23/48 ; H01L23/498 ; H01L23/552 ; H01L23/367 ; G06F1/18 ; G06F1/20 ; H05K1/14 ; H01L23/427 ; H01L23/538

Abstract:
Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.
Public/Granted literature
- US20200323076A1 THERMAL CONDUCTIVITY FOR INTEGRATED CIRCUIT PACKAGING Public/Granted day:2020-10-08
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