Invention Grant
- Patent Title: Carrier film, element transfer method using same, and electronic product manufacturing method using element transfer method
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Application No.: US16341714Application Date: 2017-10-18
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Publication No.: US11152256B2Publication Date: 2021-10-19
- Inventor: Yun Hwangbo , Byung-Ik Choi , Jae-Hyun Kim , Hak Joo Lee , Bongkyun Jang , Yeon Woo Jeong , Seong Min Hong
- Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS , Center for Advanced Meta-Materials
- Applicant Address: KR Daejeon; KR Daejeon
- Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS,Center for Advanced Meta-Materials
- Current Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS,Center for Advanced Meta-Materials
- Current Assignee Address: KR Daejeon; KR Daejeon
- Agency: Hauptman Ham, LLP
- Priority: KR10-2016-0135330 20161018
- International Application: PCT/KR2017/011532 WO 20171018
- International Announcement: WO2018/074841 WO 20180426
- Main IPC: H01L21/447
- IPC: H01L21/447 ; H01L21/768 ; C09J7/20 ; H01L21/48 ; H01L21/67
Abstract:
A carrier film according to an embodiment of the present invention comprises: a base film; and a first adhesive layer formed on a surface of the base film such that an element to be transferred is attached to the first adhesive layer, wherein the magnitude of force of adhesion between the element and the first adhesive layer is in proportion to the depth of press-fitting at which the element is press-fitted into the first adhesive layer.
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