Invention Grant
- Patent Title: Interposer circuit
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Application No.: US16666125Application Date: 2019-10-28
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Publication No.: US11152308B2Publication Date: 2021-10-19
- Inventor: Norbert Schlepple
- Applicant: Finisar Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Blank Rome LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; G02B6/42 ; H01L23/66 ; H01L23/00 ; H01L25/18 ; H04B10/80 ; H04B10/516 ; H04B10/66

Abstract:
In an example, a communication module such as an optoelectronic communication module may include an integrated circuit (IC), an electrical interconnect, and an interposer circuit. The electrical interconnect may include a radio frequency (RF) interconnect or a direct current (DC) interconnect. The interposer circuit may be electrically coupled between the IC and the electrical interconnect.
Information query
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