The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completely or partially in the multilayer structure.