Invention Grant
- Patent Title: Additive core subtractive liner for metal cut etch processes
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Application No.: US16681038Application Date: 2019-11-12
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Publication No.: US11152489B2Publication Date: 2021-10-19
- Inventor: Ruqiang Bao , Kisup Chung , Andrew M. Greene , Sivananda K. Kanakasabapathy , David L. Rath , Indira P. V. Seshadri , Rajasekhar Venigalla
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Abdy Raissinia
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/768 ; H01L23/535 ; H01L29/78 ; H01L29/08 ; H01L29/417 ; H01L21/8234 ; H01L27/088

Abstract:
An additive core subtractive liner method is described for forming electrically conductive contacts. The method can include forming a first trench in a first dielectric layer to expose a first portion of a metal liner, and filling said first trench with a second dielectric layer. A metal cut trench is formed in the second dielectric layer. A portion of the metal liner exposed by the metal cut trench is removed with a subtractive method. The method continues with filling the metal cut trench with a dielectric fill, and replacing the remaining portions of the second dielectric layer with an additive core conductor to provide contacts to remaining portions of the metal liner.
Public/Granted literature
- US20200083350A1 ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES Public/Granted day:2020-03-12
Information query
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