Disclosed is a method for fabricating CSP LEDs. The method includes: preparing a plurality of flip-type LED chips, each of which includes a substrate and a semiconductor stack structure formed under the substrate and has a first conductive connection area and a second conductive connection area formed under the semiconductor stack structure; arraying the first conductive connection areas and the second conductive connection areas of the plurality of flip-type LED chips on a temporary support sheet; forming a wavelength converting member, which includes a side surface portion surrounding the side surfaces of the substrate and the semiconductor stack structure, an intermediate portion overlying the side surface portion to cover the upper surface of the substrate, and an upper surface portion overlying the intermediate portion, on the temporary support sheet; and removing the temporary support sheet and forming first electrode pads and second electrode pads in the first conductive connection areas and the second conductive connection areas of the flip-type LED chips, respectively. The first electrode pads and the second electrode pads protrude more downward than the lower surface of the wavelength converting member.