Invention Grant
- Patent Title: Electronic component manufacturing method
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Application No.: US16578022Application Date: 2019-09-20
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Publication No.: US11152570B2Publication Date: 2021-10-19
- Inventor: Yann Canvel , Sebastien Lagrasta , Sebastien Barnola , Christelle Boixaderas
- Applicant: STMICROELECTRONICS SAS
- Applicant Address: FR Crolles
- Assignee: STMICROELECTRONICS SAS
- Current Assignee: STMICROELECTRONICS SAS
- Current Assignee Address: FR Crolles
- Agency: Seed IP Law Group LLP
- Priority: FR1858603 20180921
- Main IPC: H01L45/00
- IPC: H01L45/00
Abstract:
The disclosure concerns an electronic component manufacturing method including a first step of etching at least one first layer followed, with no exposure to oxygen, by a second step of passivating the first layer.
Public/Granted literature
- US20200098989A1 ELECTRONIC COMPONENT MANUFACTURING METHOD Public/Granted day:2020-03-26
Information query
IPC分类:
