Invention Grant
- Patent Title: Semiconductor laser device, chip on submount, and semiconductor laser module
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Application No.: US16027938Application Date: 2018-07-05
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Publication No.: US11152762B2Publication Date: 2021-10-19
- Inventor: Eisaku Kaji , Yutaka Ohki
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01S5/10
- IPC: H01S5/10 ; H01S5/22 ; H01S5/042 ; H01S5/023 ; H01S5/0233 ; H01S5/0235 ; G02B6/293 ; G02B6/32 ; G02B6/34 ; G02B6/42

Abstract:
A semiconductor laser device of an edge emission type, where a waveguide mode is multi-mode, is provided. The semiconductor laser device includes a first facet of the waveguide on an emission direction front side, the first facet having a first width in a horizontal direction perpendicular to a longitudinal direction of the waveguide; and a second facet of the waveguide on an emission direction rear side, the second facet having the first width, wherein a width of the waveguide, in the horizontal direction, is at least partially narrower than the first width, between the first facet and the second facet.
Public/Granted literature
- US20180323579A1 SEMICONDUCTOR LASER DEVICE, CHIP ON SUBMOUNT, AND SEMICONDUCTOR LASER MODULE Public/Granted day:2018-11-08
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