A high-frequency module (1) includes a component (3a) mounted on an upper surface (2a) of a substrate (2), a second sealing resin layer (4) stacked on the upper surface (2a) of the substrate (2), a component (3b) mounted on a lower surface (2b) of the substrate (2), a first sealing resin layer (5) stacked on the lower surface (2b) of the substrate (2), and a first terminal assembly (6) and a second terminal assembly (7) that are mounted on the lower surface (2b) of the substrate (2). The first terminal assembly (6) is mounted on a four-corner portion of the substrate (2) and includes a connection conductor (6a) thicker than a connection conductor (7a) of the second terminal assembly (7).