Invention Grant
- Patent Title: Movable heat-transfer system
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Application No.: US16231169Application Date: 2018-12-21
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Publication No.: US11153990B2Publication Date: 2021-10-19
- Inventor: Jeff Ku , Gavin Sung , Tim Liu , Gerry Juan , Jason Y. Jiang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; G06F1/08 ; H05K1/02

Abstract:
In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.
Public/Granted literature
- US20190141854A1 MOVABLE HEAT-TRANSFER SYSTEM Public/Granted day:2019-05-09
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