Invention Grant
- Patent Title: Systems and methods of dynamic thermal management for enhancing thermal performance in 5G enabled devices
-
Application No.: US16654166Application Date: 2019-10-16
-
Publication No.: US11157051B2Publication Date: 2021-10-26
- Inventor: Kwangyoon Lee , Adam Cunningham , Melanie Dolores Oclima , Ronald Alton , Jon James Anderson , Heekab Shin , Henri Begin
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/324 ; H04W52/02 ; G06F1/3206 ; G06F1/3296

Abstract:
Various aspects of the present disclosure include methods, components and wireless devices configured to determine appropriate generalized system-wide thermal management policies and settings in wireless devices depending upon whether communication activities are driving or otherwise causing thermal conditions. In various aspects, a processor may determine workload characteristics and select and apply an appropriate thermal management policy/solution (or thermal configuration, settings etc.) based on the determine workload characteristics. The processor may determine workload characteristics based upon data from two or more temperature sensors within the wireless device. The processor may select a generalized system-wide thermal management policy suitable for operating when communication activities (e.g., 5G communication activities) are generating so much heat that CPU-centric thermal management policies are in appropriate.
Information query