Invention Grant
- Patent Title: Packaging layer inductor
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Application No.: US16008948Application Date: 2018-06-14
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Publication No.: US11158448B2Publication Date: 2021-10-26
- Inventor: Alan Roth , Eric Soenen , Ying-Chih Hsu , Nick Samra , Stefan Rusu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Merchant & Gould P.C.
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F17/04 ; H01L23/00 ; H01F41/04 ; H01L21/56
Abstract:
An inductor is formed in an IC device packaging structure. The structure includes an encapsulating material, with a ferromagnetic core in the encapsulation material. A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor.
Public/Granted literature
- US20190385775A1 PACKAGING LAYER INDUCTOR Public/Granted day:2019-12-19
Information query
IPC分类:
| H | 电学 |
| H01 | 基本电气元件 |
| H01F | 磁体；电感；变压器；磁性材料的选择 |
| H01F17/00 | 信号类型的固定电感器 |
