Invention Grant
- Patent Title: Housing of electronic device, method of manufacturing housing of electronic device, and breaker having the same
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Application No.: US15777594Application Date: 2016-11-21
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Publication No.: US11158471B2Publication Date: 2021-10-26
- Inventor: Masashi Namikawa , Shinichi Hirota
- Applicant: BOURNS KK , POLYPLASTICS CO., LTD.
- Applicant Address: JP Osaka; JP Tokyo
- Assignee: BOURNS KK,POLYPLASTICS CO., LTD.
- Current Assignee: BOURNS KK,POLYPLASTICS CO., LTD.
- Current Assignee Address: JP Osaka; JP Tokyo
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JPJP2015-227931 20151120
- International Application: PCT/JP2016/084447 WO 20161121
- International Announcement: WO2017/086486 WO 20170526
- Main IPC: H01H37/04
- IPC: H01H37/04 ; H01H37/64 ; H01H11/00

Abstract:
Provided is a breaker capable of further downsizing without impairing rigidity and strength of a case. The breaker 1 comprises a fixed contact 21, a movable piece 4 having and pressing a movable contact 41 to the fixed contact 21, a thermally responsive element 5 for moving the movable piece 4 to separate the movable contact 41 from the fixed contact 21 by deformation thereof responding to temperature change, a case for containing the fixed piece 21, the movable piece 4 and the thermally responsive element 5, and a cover piece 8 attached on the case 7. The case 7 has an end face 72 on which the cover piece 8 is disposed, a containing recess 73 caved from the end face 72 and forming a space to which the movable piece 4 and the thermally responsive element 5 are contained, and a first protrusion protruding from the end face 72 and to which the cover piece 8 is fitted.
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