Invention Grant
- Patent Title: Wafer cassette handling apparatus and operating method thereof
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Application No.: US16714786Application Date: 2019-12-15
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Publication No.: US11158531B2Publication Date: 2021-10-26
- Inventor: Tsung-Sheng Kuo , Hsuan Lee , Hsu-Shui Liu , Jiun-Rong Pai , Chih-Hung Huang , Yang-Ann Chu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67
Abstract:
An operating method of a wafer cassette handling apparatus includes at least the following steps. A stage that carries a wafer cassette is moved into a main body of a wafer cassette handling apparatus to open a cassette door of the wafer cassette. The stage that carries the wafer cassette is moved out of the main body after the cassette door is opened. A wafer is extracted from the wafer cassette and transferred to a processing system. Another operating method and a wafer cassette handling apparatus are also provided.
Information query
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