Invention Grant
- Patent Title: Package with wall-side capacitors
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Application No.: US16341963Application Date: 2016-11-18
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Publication No.: US11158568B2Publication Date: 2021-10-26
- Inventor: Jenny Shio Yin Ong , Seok Ling Lim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- International Application: PCT/US2016/062736 WO 20161118
- International Announcement: WO2018/093379 WO 20180524
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H05K1/11 ; H05K3/34 ; H01L23/00 ; H05K3/42 ; H05K3/46

Abstract:
An apparatus is provided which comprises: a plurality of organic dielectric layers forming a substrate, a plurality of first conductive contacts on a top surface of the substrate, a plurality of second conductive contacts on a bottom surface of the substrate, a plurality of third conductive contacts on a side wall surface of the substrate, and one or more discrete capacitor(s) coupled with the third conductive contacts on the side wall surface. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20190244883A1 PACKAGE WITH WALL-SIDE CAPACITORS Public/Granted day:2019-08-08
Information query
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