Invention Grant
- Patent Title: Lid material for packages including reflowed gold-tin layers, and method for manufacturing package
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Application No.: US17260276Application Date: 2019-10-09
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Publication No.: US11158766B2Publication Date: 2021-10-26
- Inventor: Satoru Daido , Hironori Uno
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JPJP2018-194535 20181015,JPJP2019-184287 20191007
- International Application: PCT/JP2019/039826 WO 20191009
- International Announcement: WO2020/080221 WO 20200423
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01S5/02257 ; B23K35/30 ; C22C5/02 ; B23K1/00 ; B23K101/40
Abstract:
This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au—Sn layers provided on the metallized layers and having a frame shape having a width of 250 μm or less.
Public/Granted literature
- US20210249567A1 LID MATERIAL FOR PACKAGES, AND PACKAGE Public/Granted day:2021-08-12
Information query
IPC分类:
