Invention Grant
- Patent Title: Resource slicing on a sidelink interface
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Application No.: US16365329Application Date: 2019-03-26
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Publication No.: US11159935B2Publication Date: 2021-10-26
- Inventor: Hong Cheng , Sudhir Kumar Baghel , Shailesh Patil , Michaela Vanderveen , Junyi Li , Zhibin Wu , Kapil Gulati
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Harrity & Harrity, LLP
- Main IPC: H04W8/18
- IPC: H04W8/18 ; H04W4/40 ; H04W76/27 ; H04W72/04 ; H04W88/02

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may determine a service type to be used by the UE for one or more device-to-device (D2D) communications on a sidelink interface; determine a slice identifier based at least in part on the service type, wherein the slice identifier corresponds to a resource allocation to be used for the one or more D2D communications; and transmit an indication of the slice identifier. Numerous other aspects are provided.
Public/Granted literature
- US20190357033A1 RESOURCE SLICING ON A SIDELINK INTERFACE Public/Granted day:2019-11-21
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