Invention Grant
- Patent Title: Memory circuit including a first program device
-
Application No.: US16523953Application Date: 2019-07-26
-
Publication No.: US11176969B2Publication Date: 2021-11-16
- Inventor: Meng-Sheng Chang , Min-Shin Wu , Yao-Jen Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G11C11/18
- IPC: G11C11/18 ; G11C5/02 ; G11C17/12 ; G11C8/14 ; G11C17/16 ; G11C7/18 ; G06F30/39

Abstract:
A memory circuit array includes a first read device and a first program device. The first read device is coupled to a first bit line. The first read device includes a first transistor coupled to a first word line, and a second transistor coupled to the first word line. The first program device is coupled to the first read device. The first program device includes a third transistor coupled to a second word line, and a fourth transistor coupled to the second word line.
Public/Granted literature
- US20200058328A1 MEMORY CIRCUIT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-02-20
Information query