Invention Grant
- Patent Title: Semiconductor packages with external bump pads having trench portions and semiconductor modules including the semiconductor packages
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Application No.: US16807377Application Date: 2020-03-03
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Publication No.: US11177199B2Publication Date: 2021-11-16
- Inventor: Gayoung Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2019-0090493 20190725
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00
Abstract:
A semiconductor package includes a semiconductor chip including a chip pad and an external bump pad electrically connected to the chip pad of the semiconductor chip. The external bump pad may include a trench portion extending from a perimeter surface of the external bump pad toward a center of the external bump pad. The semiconductor package includes an external connector on the external bump pad, with the external connector including a portion that is in the trench portion of the external bump pad.
Public/Granted literature
- US20210028096A1 SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR MODULES INCLUDING THE SEMICONDUCTOR PACKAGES Public/Granted day:2021-01-28
Information query
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