Invention Grant
- Patent Title: Interface connector for supporting millimeter wave wireless communications
-
Application No.: US16863874Application Date: 2020-04-30
-
Publication No.: US11177553B2Publication Date: 2021-11-16
- Inventor: Sang-June Park , Peter Han Lien , Eric Lunzer , Timothy Vu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01Q23/00 ; H04B1/40 ; H01Q1/50

Abstract:
Aspects described herein relate to at least a portion of a connector configured to support wireless communications that includes multiple chambers, each at least partially enclosed by a continuous isolation structure to provide electrical signal isolation and defining an inner surface. At least one terminal in a first chamber of the multiple chambers is configured for a first interface, and at least one terminal in a second chamber of the multiple chambers is configured for a second interface.
Public/Granted literature
- US20200350658A1 INTERFACE CONNECTOR FOR SUPPORTING MILLIMETER WAVE WIRELESS COMMUNICATIONS Public/Granted day:2020-11-05
Information query